Samfurin: FR4 Buga Allolin da'ira
Aikace-aikacen samfur: SmartPhone
Rukunin allo: Multilayer
Kayan tushe: Polyimide (PI)
Kaurin Ciki: 18um
Quter Cu kauri: 35um
Launin fim ɗin murfin: Yellow
Launin abin rufe fuska mai solder: Yellow
Silkscreen: Fari
Maganin saman: ENIG
FPC kauri: 0.26 +/- 0.03mm
Nau'in stiffener: FR4, PI
Nisa Min Layi: 0.1/0.1mm
Min rami: 0.15mm
Ramin makaho:/
Ramin da aka binne:/
Haƙurin rami (nm): PTH: 士 abu: 士0.05
lBoard Layers:/
