CAPEL FPC & Flex-Rigid PCB Ƙarfin Samar da Samfura
| Samfura | Babban yawa | |||
| Haɗin haɗin kai (HDI) | ||||
| Standard Flex circuits Flex | Filayen Sassaukan Dabaru | Rigid Flex Circuit | Canjawar Membrane | |
| Daidaitaccen Girman Panel | 250mm x 400mm | Mirgine fomat | 250mmX400mm | 250mmX400mm |
| fadin layi da Tazara | 0.035mm 0.035mm | 0.010"(0.24mm) | 0.003" (0.076mm) | 0.10"(.254mm) |
| Kaurin Copper | 9um/12um/18um/35um/70um/100um/140um | 0.028mm-.01mm | 1/2 oz. kuma mafi girma | 0.005"-.0010" |
| Ƙididdigar Layer | 1-32 | 1-2 | 2-32 | 1-2 |
| VIA / GIRMAN FARUWA | ||||
| Mafi qarancin Diamita (Mechanical) Hole | 0.0004" (0.1 mm) 0.006" (0.15 mm) | N/A | 0.006" (0.15 mm) | mil 10 (0.25 mm) |
| Mafi ƙarancin Ta (Laser) Girman | 4 mil (0.1mm) 1 mil (0.025 mm) | N/A | 6 mil (0.15 mm) | N/A |
| Mafi ƙarancin Micro Via (Laser) Girman | 3 mil (0.076 mm) 1 mil (0.025 mm) | N/A | 3 mil (0.076 mm) | N/A |
| Kayan stiffener | Polyimide / FR4 / Metal / SUS / Alu | PET | FR-4 / Poyimide | PET / Karfe/FR-4 |
| Kayan Garkuwa | Copper / azurfa Lnk / Tatsuta / Carbon | Foil na Azurfa/Tatsuta | Copper / Azurfa Tawada / Tatduta / Carbon | Takardun Azurfa |
| Kayan Aikin Kayan aiki | 2 mil (0.051 mm) 2 mil (0.051 mm) | mil 10 (0.25mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| Zif Haƙuri | 2 mil (.051 mm) 1 mil (0.025 mm) | mil 10 (0.25mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| MASKIYA MAI SOJA | ||||
| Solder Mask Bridge Tsakanin Dam | 5 mil (.013 mm) 4 mil (0.01mm) | N/A | 5 mil (0.13 mm) | mil 10 (0.25mm) |
| Haƙuri na Rijista Masks | 4 mil (.010 mm) 4 mil (0.01mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| KYAUTA | ||||
| Rijistar Rufewa | 8m5 ku | mil 10 | 8 mil | mil 10 |
| Rijistar PIC | 7m4 ku | N/A | 7 mil | N/A |
| Rijistar Mashin Solder | 5m4 ku | N/A | 5 mil | 5 mil |
| Ƙarshen Sama | ENIG/Immersion Azurfa/Tsarin Rufewa/Gold Plating/Tin Plating/OSP/ ENEPIG | |||
| Labari | ||||
| Mafi ƙarancin Tsayi | 35 mil 25 mil | mil 35 | mil 35 | Rubutun zane |
| Ƙananan faɗi | 8 mil 6 | 8 mil | 8 mil | |
| Mafi ƙarancin sarari | 8 mil 6 | 8 mil | 8 mil | |
| Rijista | ± 5mil ± 5mil | ± 5mil | ± 5mil | |
| Impedance | ± 10% ± 10% | ± 20% | ± 10% | NA |
| SRD (Dokar Karfe Die) | ||||
| Haƙuri na Shaci | 5 mil (0.13 mm) 2 mil (0.051 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| Mafi ƙarancin radius | 5 mil (0.13 mm) 4 mil (0.10 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| A cikin Radius | 20 mil (0.51 mm) 10 mil (0.25 mm) | N/A | mil 31 | 20 mil (0.51 mm) |
| Punch Mafi ƙarancin Girman Ramin | 40 mil (10.2 mm) 31.5 mil (0.80 mm) | N/A | N/A | 40 mil (1.02 mm) |
| Hakuri da Girman Ramin Punch | ± 2mil (0.051 mm) ± 1 mil | N/A | N/A | ± 2 mil (0.051 mm) |
| Ramin Nisa | 20 mil (0.51 mm) 15 mil (0.38 mm) | N/A | mil 31 | 20 mil (0.51 mm) |
| Haƙuri na rami don fayyace | ± 3 mil 2 mil | N/A | ± 4 mil | mil 10 |
| Haƙuri na gefen rami don fayyace | ± 4 mil 3 mil | N/A | ± 5 mil | mil 10 |
| Mafi ƙarancin Trace don fayyace | 8m5 ku | N/A | mil 10 | mil 10 |
Ƙarfin Samar da CAPEL PCB
| Ma'aunin Fasaha | ||
| A'a. | Aikin | Manuniya na fasaha |
| 1 | Layer | 1-60 (Layer) |
| 2 | Matsakaicin wurin sarrafawa | 545 x 622 mm |
| 3 | Mafi qarancin kauri | 4 (Layer) 0.40mm |
| 6 (Layer) 0.60mm | ||
| 8 (Layer) 0.8mm | ||
| 10 (Layer) 1.0mm | ||
| 4 | Mafi ƙarancin faɗin layi | 0.0762 mm |
| 5 | Mafi ƙarancin tazara | 0.0762 mm |
| 6 | Mafi ƙarancin buɗaɗɗen inji | 0.15mm |
| 7 | Ramin bangon jan karfe | 0.015 mm |
| 8 | Jurewar buɗaɗɗen ƙarfe | ± 0.05mm |
| 9 | Haƙurin buɗaɗɗen ƙarfe mara ƙarfe | ± 0.025mm |
| 10 | Haƙuri ramuka | ± 0.05mm |
| 11 | Haƙuri na girma | ± 0.076mm |
| 12 | Mafi ƙarancin gada mai siyarwa | 0.08mm |
| 13 | Juriya na rufi | 1E+12Ω (na al'ada) |
| 14 | rabon kauri na faranti | 1:10 |
| 15 | Thermal girgiza | 288 ℃ (sau 4 a cikin dakika 10) |
| 16 | Karkatawa da lankwasa | ≤0.7% |
| 17 | Ƙarfin wutar lantarki | 1.3KV/mm |
| 18 | Ƙarfin cirewa | 1.4N/mm |
| 19 | Solder tsayayya taurin | ≥6H |
| 20 | Dagewar harshen wuta | 94V-0 |
| 21 | Sarrafa impedance | ± 5% |
Ƙarfin Samar da CAPEL PCBA
| Kashi | Cikakkun bayanai | |
| Lokacin Jagora | 24 hours Prototyping, lokacin isar da ƙaramin tsari shine kusan kwanaki 5. | |
| PCBA Capacity | SMT facin maki miliyan 2 / rana, THT 300,000 maki / rana, oda 30-80 / rana. | |
| Abubuwan Sabis | Turnkey | Tare da balagagge kuma ingantaccen tsarin sarrafa kayan sayayya, muna hidimar ayyukan PCBA tare da babban aiki mai tsada. Tawagar ƙwararrun injiniyoyin sayayya da ƙwararrun ma'aikatan siye ne ke da alhakin saye da sarrafa abubuwan haɗin gwiwar abokan cinikinmu. |
| Kitted ko Consigned | Tare da ƙungiyar sarrafa siyayya mai ƙarfi da sassan samar da kayayyaki, Abokan ciniki suna ba mu abubuwan haɗin gwiwa, muna yin aikin haɗuwa. | |
| Combo | Karɓar abubuwan da aka gyara ko na musamman abokan ciniki suna samar da su. da kuma abubuwan samar da kayan aiki don abokan ciniki. | |
| Nau'in Solder PCBA | SMT, THT, ko PCBA saida sabis duka. | |
| Solder Manna/Tin Waya/Tin Bar | gubar da mara guba (mai yarda da RoHS) ayyukan sarrafa PCBA. Sannan kuma samar da manna solder na musamman. | |
| Stencil | Laser yankan stencil don tabbatar da cewa aka gyara kamar kananan-fitch ICs da BGA saduwa IPC-2 Class ko mafi girma. | |
| MOQ | 1 yanki, amma muna ba abokan cinikinmu shawara don samar da aƙalla samfuran 5 don nasu bincike da gwaji. | |
| Girman sashi | • Abubuwan da ake buƙata: muna da kyau a dacewa da inch 01005 (0.4mm * 0.2mm), 0201 irin waɗannan ƙananan abubuwan. | |
| • Madaidaicin ICs kamar BGA: Za mu iya gano abubuwan BGA tare da tazarar Min 0.25mm ta X-ray. | ||
| Kunshin Bangaren | reel, yankan tef, tubing, da pallets don abubuwan SMT. | |
| Matsakaicin Daidaitaccen Dutsen Abun Abu (100FP) | Daidaitawa shine 0.0375mm. | |
| Nau'in PCB mai siyarwa | PCB (FR-4, karfe substrate), FPC, PCB mai tsauri, PCB Aluminum, HDI PCB. | |
| Layer | 1 - 30 (Layer) | |
| Matsakaicin wurin sarrafawa | 545 x 622 mm | |
| Mafi qarancin kauri | 4 (Layer) 0.40mm | |
| 6 (Layer) 0.60mm | ||
| 8 (Layer) 0.8mm | ||
| 10 (Layer) 1.0mm | ||
| Mafi ƙarancin faɗin layi | 0.0762 mm | |
| Mafi ƙarancin tazara | 0.0762 mm | |
| Mafi ƙarancin buɗaɗɗen inji | 0.15mm | |
| Ramin bangon jan karfe | 0.015 mm | |
| Jurewar buɗaɗɗen ƙarfe | ± 0.05mm | |
| Buɗewar da ba ta ƙarfe ba | ± 0.025mm | |
| Haƙuri ramuka | ± 0.05mm | |
| Haƙuri na girma | ± 0.076mm | |
| Mafi ƙarancin gada mai siyarwa | 0.08mm | |
| Juriya na rufi | 1E+12Ω (na al'ada) | |
| rabon kauri na faranti | 1:10 | |
| Thermal girgiza | 288 ℃ (sau 4 a cikin dakika 10) | |
| Karkatawa da lankwasa | ≤0.7% | |
| Ƙarfin wutar lantarki | 1.3KV/mm | |
| Ƙarfin cirewa | 1.4N/mm | |
| Solder tsayayya taurin | ≥6H | |
| Dagewar harshen wuta | 94V-0 | |
| Sarrafa impedance | ± 5% | |
| Tsarin Fayil | BOM, PCB Gerber, Zaɓi da Wuri. | |
| Gwaji | Kafin isarwa, za mu yi amfani da hanyoyin gwaji iri-iri zuwa PCBA da ke kan dutse ko riga mai hawa: | |
| • IQC: dubawa mai shigowa; | ||
| • IPQC: dubawa a cikin samarwa, gwajin LCR don yanki na farko; | ||
| • QC na gani: duba ingancin yau da kullun; | ||
| • AOI: tasirin siyar da abubuwan faci, ƙananan sassa ko polarity na abubuwan da aka gyara; | ||
| • X-Ray: duba BGA, QFN da sauran manyan madaidaicin ɓoyayyun abubuwan PAD; | ||
| • Gwajin Aiki: Gwajin gwaji da aiki bisa ga hanyoyin gwajin abokin ciniki da hanyoyin don tabbatar da yarda. | ||
| Gyara & Sake Aiki | Sabis ɗin Gyaran BGA ɗinmu na iya cire ɓoyayyen wuri, matsayi, da kuma gurbataccen BGA da sake haɗa su zuwa PCB daidai. | |
