A cikin wannan shafin yanar gizon, za mu tattauna wasu shahararrun jiyya na sama da fa'idodin su don taimaka muku haɓaka tsarin ƙirƙira PCB mai Layer 12.
A fagen da'irori na lantarki, allon da aka buga (PCBs) na taka muhimmiyar rawa wajen haɗawa da sarrafa kayan aikin lantarki daban-daban. Yayin da fasaha ke ci gaba, buƙatar ƙarin ci gaba da rikitarwa PCBs yana ƙaruwa sosai. Saboda haka, PCB masana'antu ya zama wani muhimmin mataki a samar da high quality-na'urorin lantarki.
Wani muhimmin al'amari da za a yi la'akari yayin masana'antar PCB shine shirye-shiryen saman.Maganin saman yana nufin sutura ko ƙarewa da ake amfani da su akan PCB don kare shi daga abubuwan muhalli da haɓaka aikin sa. Akwai zaɓuɓɓukan jiyya na sama iri-iri da ake akwai, kuma zabar cikakkiyar jiyya don allo mai Layer 12 na iya tasiri sosai da aikin sa da amincinsa.
1.HASL (matakin solder mai zafi):
HASL wata hanya ce ta jiyya da ake amfani da ita sosai wacce ta ƙunshi tsoma PCB cikin narkakkar solder sannan kuma amfani da wukar iska mai zafi don cire abin da ya wuce gona da iri. Wannan hanyar tana ba da mafita mai inganci tare da ingantaccen solderability. Duk da haka, yana da wasu iyakoki. Mai yiyuwa ne ba za a rarraba mai siyar ba daidai gwargwado a saman, yana haifar da rashin daidaituwa. Bugu da ƙari, yawan zafin jiki mai zafi yayin aiwatarwa zai iya haifar da damuwa na thermal akan PCB, yana shafar amincinsa.
2. ENIG (Zinar nickel nutsewar zinare):
ENIG sanannen zaɓi ne don jiyya a saman saboda kyakkyawan walƙiya da kwanciyar hankali. A cikin tsarin ENIG, an ajiye wani ɗan ƙaramin nickel na nickel akan saman tagulla, sannan kuma ɗan ƙaramin zinari. Wannan magani yana tabbatar da juriya mai kyau na iskar shaka kuma yana hana lalacewar tagulla. Bugu da ƙari, rarraba zinariya iri ɗaya a saman yana ba da fili mai laushi da santsi, yana sa ya dace da abubuwan da aka gyara. Koyaya, ba a ba da shawarar ENIG don aikace-aikacen mitoci masu yawa ba saboda yuwuwar asarar sigina ta hanyar shingen shingen nickel.
3. OSP (Ma'ajin solderability na kwayoyin halitta):
OSP hanya ce ta jiyya da ke tattare da yin amfani da siraran kwayoyin halitta kai tsaye zuwa saman jan karfe ta hanyar sinadarai. OSP yana ba da mafita mai tsada kuma mai dacewa da muhalli saboda baya buƙatar kowane ƙarfe mai nauyi. Yana bayar da lebur da santsi surface tabbatar da kyau kwarai solderability. Koyaya, suturar OSP suna kula da danshi kuma suna buƙatar yanayin ajiya mai dacewa don kiyaye amincin su. Allolin da aka yi wa OSP suma sun fi sauƙi ga ɓarna da lalacewa fiye da sauran jiyya na saman.
4. Azurfa na nutsewa:
Azurfa nutsewa, wanda kuma aka sani da azurfar nutsewa, sanannen zaɓi ne don PCBs masu tsayin gaske saboda kyawawan halayensa da ƙarancin shigarsa. Yana bayar da lebur, santsi surface tabbatar da abin dogara solderability. Azurfa nutsewa yana da fa'ida musamman ga PCBs tare da abubuwan da aka gyara masu kyau da aikace-aikace masu sauri. Koyaya, saman azurfa yakan yi ɓata a cikin yanayi mai ɗanɗano kuma yana buƙatar kulawa da kyau da adanawa don kiyaye mutuncin su.
5. Gilashin zinari mai wuya:
Gilashin zinari mai wuya ya haɗa da ajiye wani kauri mai kauri na zinariya akan saman jan ƙarfe ta hanyar sarrafa lantarki. Wannan jiyya na saman yana tabbatar da kyakkyawan ingancin wutar lantarki da juriya na lalata, yana sa ya dace da aikace-aikacen da ke buƙatar maimaita shigarwa da cire abubuwan da aka gyara. Ana amfani da platin zinari mai wuya akan masu haɗa baki da maɓalli. Koyaya, farashin wannan jiyya yana da inganci idan aka kwatanta da sauran jiyya na saman.
a takaice, Zaɓin cikakkiyar ƙarewar ƙasa don PCB mai Layer 12 yana da mahimmanci ga aikinsa da amincinsa.Kowane zaɓi na jiyya na saman yana da fa'ida da iyakancewa, kuma zaɓin ya dogara da takamaiman buƙatun aikace-aikacenku da kasafin kuɗi. Ko ka zabi tsada-tasiri feshi tin, abin dogara nutse zinariya, muhalli m OSP, high-mitar nutse azurfa, ko m wuya zinariya plating, fahimtar fa'idodi da la'akari ga kowane magani zai taimake ka hažaka your PCB masana'antu tsari da kuma tabbatar da nasarar da. kayan aikin ku na Electronic.
Lokacin aikawa: Oktoba-04-2023
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