Gabatarwa: Kalubalen Fasaha a cikin Kayan Lantarki na Motoci daSabuntawar Capel

Kamar yadda tuki mai cin gashin kansa ke tasowa zuwa L5 da tsarin sarrafa batir (EV) tsarin sarrafa baturi (BMS) suna buƙatar mafi girman ƙarfin kuzari da aminci, fasahar PCB na al'ada suna gwagwarmaya don magance matsaloli masu mahimmanci:

• Hatsarin Runaway Thermal: ECU kwakwalwan kwamfuta sun zarce amfani da wutar lantarki 80W, tare da yanayin zafi na gida ya kai 150°C
• Iyakokin Haɗin kai na 3DBMS yana buƙatar tashoshin sigina 256+ a cikin kauri na 0.6mm
• Kasawar Jijjiga: Na'urori masu sarrafa kansu dole ne su yi tsayayya da girgiza injin 20G
• Buƙatun Miniaturization: Masu kula da LiDAR suna buƙatar faɗin alamar 0.03mm da tari mai Layer 32

Fasahar Capel, tana ba da damar yin amfani da shekaru 15 na R&D, yana gabatar da hanyar haɗin kai mai canzawahigh thermal watsin PCBs(2.0W/mK),PCBs masu juriya mai zafi(-55°C ~ 260°C), kuma32-LafiyaHDI binne/makafi ta hanyar fasaha(0.075mm microvias).

Sashi na 1: Juyin Gudanar da Zazzabi don Tuƙi Mai Ikon Kai Tsakanin ECUs

1.1 Kalubalen zafi na ECU

• Matsakaicin zafi na Nvidia Orin chipset: 120W/cm²
• Abubuwan FR-4 na al'ada (0.3W/mK) suna haifar da 35% guntu junction zafin jiki
• Kashi 62% na gazawar ECU sun samo asali ne daga gajiyawar solder da ke haifar da matsananciyar zafi

1.2 Fasahar Haɓaka Zazzabi na Capel

Sabbin abubuwa:

• Nano-alumina da aka ƙarfafa polyimide substrates (2.0 ± 0.2W / mK thermal conductivity)
• 3D ginshiƙan ginshiƙan jan ƙarfe (ƙarar ɓarkewar zafi 400%)

Tsari Nasarar:

• Laser Direct Structuring (LDS) don ingantattun hanyoyin zafi
• Hybrid stacking: 0.15mm matsananci-bakin ciki jan karfe + 2oz nauyi tagulla yadudduka

Kwatancen Ayyuka:

Sashi na 2: Juyin Juyin Waya ta BMS tare da Fasaha HDI mai Layer 32

2.1 Abubuwan Ciwo na Masana'antu a Tsarin BMS

• 800V dandamali na bukatar 256+ cell ƙarfin lantarki saka idanu tashoshi
• Zane-zane na al'ada sun wuce iyakokin sarari da 200% tare da rashin daidaituwa na 15% na impedance

2.2 Haɗin Haɗin Haɗin Haɓakawa Mai Girma na Capel

Injiniya Stackup:

• 1+N+1 kowane Layer HDI tsarin (32 yadudduka a 0.035mm kauri)
• ± 5% kulawar impedance bambanci (10Gbps sigina mai sauri)

Fasahar Microvia:

• 0.075mm Laser-makãho vias (12: 1 al'amari rabo)
• <5% plating void rate (IPC-6012B Class 3 complient)

Sakamakon Benchmark:

Sashi na 3: Babban Dogaran Muhalli - MIL-SPEC Tabbatattun Magani

3.1 Babban Ayyukan Material Zazzabi

• Yanayin Canjin Gilashin (Tg): 280°C (IPC-TM-650 2.4.24C)
• Zazzabi Mai Ruɓawa (Td): 385°C (5% asarar nauyi)
• Tsirawar Girgizar Ruwa: Zagayowar 1,000 (-55°C↔260°C)

3.2 Fasahar Kariyar Mallaka

• Rubutun Plasma-Grafted polymer (juriyawar gishiri 1,000h)
• 3D EMI karewa cavities (60dB attenuation @10GHz)

Sashi na 4: Nazarin Harka - Haɗin kai tare da Top 3 EV OEM na Duniya

4.1 800V BMS Sarrafa Module

• Kalubale: Haɗa 512-tashar AFE a cikin sararin 85 × 60mm
• Magani:
  1. 20-Layer m-launi PCB (3mm lanƙwasa radius)
  2. Cikakkun cibiyar sadarwa na firikwensin zafin jiki (0.03mm nisa na alama)
  3. Ƙarfe-core sanyaya (0.15°C·cm²/W thermal juriya)

4.2 L4 Mai sarrafa Domain Mai sarrafa kansa

• Sakamako:
  • Rage wutar lantarki 40% (72W → 43W)
  • Rage girman 66% vs. na al'ada kayayyaki
  • ASIL-D Takaddar aminci na aiki

Sashi na 5: Takaddun shaida da Tabbacin Inganci

Tsarin ingancin Capel ya zarce mizanan motoci:

• Takaddar MIL-SPEC: Mai yarda da GJB 9001C-2017
• Yarda da Motoci: IATF 16949: 2016 + AEC-Q200 ingantacce
• Gwajin dogaro:
  • 1,000h HAST (130°C/85% RH)
  • 50G injin girgiza (MIL-STD-883H)

Kammalawa: Taswirar Fasaha ta PCB na gaba-Gen

Capel yana hidimar majagaba:

• Abubuwan da aka haɗa (30% ajiyar sarari)
• Optoelectronic matasan PCBs (asara 0.2dB/cm @850nm)
• Tsarin DFM da AI ke kokawa (15% haɓaka yawan amfanin ƙasa)

Tuntuɓi ƙungiyar injiniyoyinmuyau don haɓaka hanyoyin haɗin PCB na musamman don na'urorin lantarki na kera na gaba.